数字集成电路与嵌入式内核系统可测试性设计pdf电子书版本下载

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1 Test and Design-for-Test Fundamentals 1

1.1 Introduction to Test and DFT Fundamentals 3

1.1.1 Puupose 3

1.1.2 Introduction to Test,the Test Process,and Design-for-Test 3

1.1.3 Concurrent Test Engineering 4

1.2 The Reasons for Testing 7

1.2.1 Why Test?Why Add Test Logic? 7

1.2.2 Pro and Con Perceptions of DFT 7

1.3.1 What Is Testing? 10

1.3 The Definition of Testing 10

1.3.2 Stimulus 11

1.3.3 Response 11

1.4 Test Measurement Criteria 13

1.4.1 What Is Measured? 13

1.4.2 Fault Metric Mathematics 14

1.5 Fault Modeling 16

1.5.1 Physical Defects 16

1.5.2 Fault Modeling 16

1.6.3 Combinational Exhaustive and Pseudo-Exhaustive Testing 20

1.6.2 Structural Testing 20

1.6.1 Functional Testing 20

1.6 Types of Testing 20

1.6.4 Full Exhaustive Testing 21

1.6.5 Test Styles 21

1.7 Manufacturing Test 23

1.7.1 The Manufacturing Test Process 23

1.7.2 Manufacturing Test Load Board 23

1.7.3 Manufacturing Test Program 23

1.8.3 ATE Cost Considerations 25

1.8.2 ATE Limitations 25

1.8.1 Automatic Test Equipment 25

1.8 Using Automatic Test Equipment 25

1.9 Test and Pin Timing 27

1.9.1 Tester and Device Pin Timing 27

1.9.2 Tester Edge Sets 27

1.9.3 Tester Precision and Accuracy 28

1.10 Manufacturing Test Program Components 30

1.10.1 The Pieces and Parts of a Test Program 30

1.10.2 Test Program Optimization 32

1.11 Recommended Reading 33

2 Automatic Test Pattern Generation Fundamentals 35

2.1.2 Introduction to Automated Test Pattern Generation 37

2.1.1 Purpose 37

2.1 Introduction to Automatic Test Pattern Generation 37

2.1.3 The Vector Generation Process Flow 38

2.2 The Reasons for ATPG 41

2.2.1 Why ATPG? 41

2.2.2 Pro and Con Perceptions of ATPG 41

2.3 The Automatic Test Pattern Generation Process 44

2.3.1 Introduction to ATPG 44

2.4 Introducing the Combinational Stuck-At Fault 47

2.4.1 Combinational Stuck-At Faults 47

2.4.2 Combinational Stuck-At Fault Detection 47

2.5.2 Delay Fault Detection 49

2.5 Introducing the Delay Fault 49

2.5.1 Delay Faults 49

2.6 Introducing the Current-Based Fault 52

2.6.1 Current-Based Testing 52

2.6.2 Cuffent-Based Testing Detection 52

2.7 Testability and Fault Analysis Methods 54

2.7.1 Why Conduct ATPG Analysis or Testability Analysis? 54

2.7.2 What Types of Testability Analysis Are Available? 54

2.7.3 Fault Effective Circuits 54

2.7.4 Controllability-Observability Analysis 55

2.7.5 Circuit Learning 56

2.8.1 Causes and Effects of Fault Masking 58

2.8.2 Fault Masking on Various Fault Models 58

2.8 Fault Masking 58

2.9 Stuck Fault Equivalence 60

2.9.1 Fault Equivalence Optimization 60

2.9.2 Fault Equivalence Side Effects 60

2.10 Stuck-At ATPG 62

2.10.1 Fault Selection 62

2.10.2 Exercising the Fault 63

2.10.3 Detect Path Sensitization 63

2.11.1 Using ATPG with Transition Delay Faults 65

2.11 Transition Delay Fault ATPG 65

2.11.2 Transition Delay Is a Gross Delay Fault 66

2.12 Path Delay Fault ATPG 68

2.12.1 Path Delay ATPG 68

2.12.2 Robust Fault Detection 68

2.12.3 The Path Delay Design Description 69

2.12.4 Path Enumeration 69

2.13 Current-Based Fault ATPG 71

2.13.1 Current-Based ATPG Algorithms 71

2.14.1 Multiple Cycle Sequential Test Pattern Generation 73

2.14 Combinational versus Sequential ATPG 73

2.14.2 Multiple Time Frame Combinational ATPG 74

2.14.3 Two-Time-Frame ATPG Limitations 75

2.14.4 Cycle-Based ATPG Limitations 75

2.15 Vector Simulation 77

2.15.1 Fault Simulation 77

2.15.2 Simulation for Manufacturing Test 77

2.16 ATPG Vectors 80

2.16.1 Vector Formats 80

2.16.2 Vector Compaction and Compression 80

2.17.1 The ATPG Tool NO Rules List 83

2.17 ATPG-Based Design Rules 83

2.17.2 Exceptions to the Rules 84

2.18 Selecting an ATPG Tool 87

2.18.1 The Measurables 87

2.18.2 The ATPG Benchmark Process 88

2.19 ATPG Fundamentals Summary 91

2.19.1 Establishing an ATPG Methodology 91

2.20 Recommended Reading 92

3 Scan Architectures and Techniques 93

3.1.2 The Testing Problem 95

3.1.1 Purpose 95

3.1 Introduction to Scan-Based Testing 95

3.1.3 Scan Testing 96

3.1.4 Scan Testing Misconceptions 96

3.2 Functional Testing 99

3.3 The Scan Effective Circuit 101

3.4 The Mux-D Style Scan Flip-Flops 103

3.4.1 The Multiplexed-D Flip-Flop Scan Cell 103

3.4.2 Perceived Silicon Impact of the Mux-D Scan Flip-Flop 103

3.4.3 Other Types of Scan Flip-Flops 103

3.4.4 Mixing Scan Styles 104

3.5 Preferred Mux-D Scan Flip-Flops 106

3.5.1 Operation Priority of the Multiplexed-D Flip-Flop Scan Cell 106

3.5.2 The Mux-D Flip-Flop Family 106

3.6 The Scan Shift Register or Scan Chain 108

3.6.1 The Scan Architecture for Test 108

3.6.2 The Scan Shift Register(a.k.a The Scan Chain) 108

3.7 Scan Cell Operations 110

3.7.1 Scan Cell Transfer Functions 110

3.8 Scan Test Sequencing 112

3.9 Scan Test Timing 115

3.10 Safe Scan Shifting 118

3.11 Safe Scan Sampling:Contention-Free Vectors 120

3.11.1 Contention-Free Vectors 120

3.12 Partial Scan 122

3.12.1 Scan Testing with Partial-Scan 122

3.12.2 Sequential ATPG 122

3.13 Multiple Scan Chains 125

3.13.1 Advantages of Multiple Scan Chains 125

3.13.2 Balanced Scan Chains 125

3.14.2 The Shared Scan Input Interface 128

3.14.1 Setting up a Borrowed Scan Interface 128

3.14 The Borrowed Scan Interface 128

3.14.3 The Shared Scan Output Interface 129

3.15 Clocking,On-Chip Clock Sources,and Scan 131

3.15.1 On-Chip Clock Sources and Scan Testing 131

3.15.2 On-Chip Clocks and Being Scan Tested 131

3.16 Scan-Based Design Rules 134

3.16.1 Scan-Based DFT and Design Rules 134

3.16.2 The Rules 134

3.17.1 DC Scan Insertion 139

3.17.2 Extras 139

3.17 Stuck-At(DC)Scan Insertion 139

3.17.3 DC Scan Insertion and Multiple Clock Domains 140

3.18 Stuck-At Scan Diagnostics 142

3.18.1 Implementing Stuck-At Scan Diagnostics 142

3.18.2 Diagnostic Fault Simulation 142

3.18.3 Functional Scan-Out 143

3.19 At-Speed Scan(AC)Test Goals 145

3.19.1 AC Test Goals 145

3.19.2 Cost Drivers 145

3.20.2 At-Speed Scan Sequence 148

3.20.3 At-Speed Scan versus DC Scan 148

3.20.1 Uses of At-Speed Scan Testing 148

3.20 At-Speed Scan Testing 148

3.21 The At-Speed Scan Architecture 150

3.21.1 At-Speed Scan Interface 150

3.21.2 At-Speed Safe Shifting Logic 150

3.21.3 At-Speed Scan Sample Architecture 150

3.22 The At-Speed Scan Interface 152

3.22.1 At-Speed Scan Shift Interface 152

3.22.2 At-Speed Scan Sample Interface 152

3.23 Multiple Clock and Scan Domain Operation 154

3.23.1 Multiple Timing Domains 154

3.24.1 Multiple Clock Domains,Clock Skew,and Scan Insertion 157

3.24 Scan Insertion and Clock Skew 157

3.24.2 Multiple Time Domain Scan Insertion 158

3.25 Scan Insertion for At-Speed Scan 161

3.25.1 Scan Cell Substitution 161

3.25.2 Scan Control Signal Insertion 161

3.25.3 Scan Interface Insertion 161

3.25.4 Other Considerations 161

3.26.1 Critical Paths 163

3.26.2 Critical Path Selection 163

3.26 Critical Paths for At-Speed Scan 163

3.26.3 Path Filtering 164

3.26.4 False Path Content 165

3.26.5 Real Critical Paths 166

3.26.6 Critical Path Scan-Based Diagnostics 166

3.27 Scan-Based Logic BIST 168

3.27.1 Pseudo-Random Pattern Generation 168

3.27.2 Signature Analysis 168

3.27.3 Logic Built-In Self-Test 168

3.27.4 LFSR Science(A Quick Tutorial) 169

3.27.6 Aliasing 170

3.27.5 X-Management 170

3.28 Scan Test Fundamentals Summary 173

3.29 Recommended Reading 174

4 Memory Test Architectures and Techniques 175

4.1 Introduction to Memory Testing 177

4.1.1 Purpose 177

4.1.2 Introduction to Memory Test 177

4.2 Types of Memories 180

4.2.1 Categorizing Memory Types 180

4.3.1 Types of Memory Organization 183

4.3 Memory Organization 183

4.4 Memory Design Concerns 186

4.4.1 Trade-Offs in Memory Design 186

4.5 Memory Integration Concerns 188

4.5.1 Key Issues in Memory Integration 188

4.6 Embedded Memory Testing Methods 190

4.6.1 Memory Test Methods and Options 190

4.7 The Basic Memory Testing Model 193

4.7.1 Memory Testing 193

4.7.2 Memory Test Fault Model 193

4.7.3 Memory Test Failure Modes 193

4.8.1 Stuck-At Based Memory Bit-Cell Fault Models 195

4.8.2 Stuck-At Fault Exercising and Detection 195

4.8 The Stuck-At Bit-Cell Based Fault Models 195

4.9 The Bridging Defect-Based Fault Models 197

4.9.1 Bridging Defect-Based Memory Test Fault Models 197

4.9.2 Linking Defect Memory Test Fault Models 197

4.9.3 Bridging Fault Exercising and Detection 197

4.10 The Decode Fault Model 199

4.10.1 Memory Decode Fault Models 199

4.10.2 Decode Fault Exercising and Detection 199

4.11.2 DRAM Refresh Requirements 201

4.11 The Data Retention Fault 201

4.11.1 Memory Test Data Retention Fault Models 201

4.12 Diagnostic Bit Mapping 203

4.12.1 Memory Test Diagnostics:Bit Mapping 203

4.13 Algorithmic Test Generation 205

4.13.1 Introduction to Algorithmic Test Generation 205

4.13.2 Automatic Test Generation 205

4.13.3 BIST-Based Algorithmic Testing 206

4.14.3 Input Observation 208

4.14.2 Memory Interaction Methods 208

4.14.4 Output Control 208

4.14 Memory Interaction with Scan Testing 208

4.14.1 Scan Test Considerations 208

4.15 Scan Test Memory Modeling 210

4.15.1 Modeling the Memory for ATPG Purposes 210

4.15.2 Limitations 210

4.16 Scan Test Memory Black-Boxing 212

4.16.1 The Memory Black-Boxing Technique 212

4.16.2 Limitations and Concerns 212

4.17 Scan Test Memory Transparency 214

4.17.1 The Memory Transparency Technique 214

4.17.2 Limitations and Concerns 214

4.18.2 Limitations and Concerns 216

4.18 Scan Test Memory Model of The Fake Word 216

4.18.1 The Fake Word Technique 216

4.19 Memory Test Requirements for MBIST 218

4.19.1 Memory Test Organization 218

4.20 Memory Built-In Self-Test Requirements 220

4.20.1 Overview of Memory BIST Requirements 220

4.20.2 At-Speed Operation 220

4.21 An Example Memory BIST 222

4.21.1 A Memory Built-In Self-Test 222

4.21.2 Optional Operations 223

4.21.3 An Example Memory Built-In Self-Test 223

4.22.1 Integrating Memory BIST 225

4.22 MBIST Chip Integration Issues 225

4.23 MBIST Integration Concerns 227

4.23.1 MBIST Default Operation 227

4.24 MBIST Power Concerns 229

4.24.1 Banked Operation 229

4.25 MBIST Design—Using LFSRs 231

4.25.1 Pseudo-Random Pattern Generation for Memory Testing 231

4.25.2 Signature Analysis and Memory Testing 231

4.25.3 Signature Analysis and Diagnostics 231

4.26.2 Output Assessment 234

4.26.1 Shift-Based Memory Testing 234

4.26 Shift-Based Memory BIST 234

4.27 ROM BIST 236

4.27.1 Purpose and Function of ROM BIST 236

4.27.2 The ROM BIST Algorithm 237

4.27.3 ROM MISR Selection 237

4.27.4 Signature Compare Method 238

4.28 Memory Test Summary 240

4.29 Recommended Reading 240

5 Embedded Core Test Fundamentals 241

5.1.2 Introduction to Embedded Core-Based Chip Testing 243

5.1.1 Purpose 243

5.1 Introduction to Embedded Core Testing 243

5.1.3 Reuse Cores 244

5.1.4 Chip Assembly Using Reuse Cores 244

5.2 What Is a Core? 246

5.2.1 Defining Cores 246

5.2.2 The Core DFT and Test Problem 246

5.2.3 Built-In DFT 246

5.3 What is Core-Based Design? 248

5.3.1 Design of a Core-Based Chip 248

5.3.2 Core-Based Design Fundamentals 248

5.4.1 Embedded Core Deliverables 250

5.4 Reuse Core Deliverables 250

5.5 Core DFT Issues 252

5.5.1 Embedded Core-Based Design Test Issues 252

5.6 Development of a ReUsable Core 256

5.6.1 Embedded Core Considerations for DFT 256

5.7 DFT Interface Considerations—Test Signals 262

5.7.1 Embedded Core Interface Considerations for DFT—Test Signals 262

5.8 Core DFT Interface Concerns—Test Access 265

5.8.1 Test Access to the Core Interface 265

5.9.2 The Test Wrapper as a Frequency Interface 268

5.9.1 The Test Wrapper as a Signal reduction Element 268

5.9 DFT Interface Concerns—Test Wrappers 268

5.9.3 The Test Wrapper as a Virtual Test Socket 269

5.10 The Registered Isolation Test Wrapper 271

5.11 The Slice Isolation Test Wrapper 273

5.12 The Isolation Test Wrapper—Slice Cell 275

5.13 The Isolation Test Wrapper—Core DFT Interface 277

5.14 Core Test Mode Default Values 279

5.14.1 Internal versus External Test Quiescence Defaults Application 279

5.15.2 Test Clock Source Considerations 281

5.15.1 Lack of Bidirectional Signals 281

5.15 DFT Interface Wrapper Concerns 281

5.16 DFT Interface Concerns—Test Frequency 284

5.16.1 Embedded Core Interface Concerns for DFT—Test Frequency 284

5.16.2 Solving the Frequency Problem 284

5.17 Core DFT Development 286

5.17.1 Internal Parallel Scan 286

5.17.2 Wrapper Parallel Scan 286

5.17.3 Embedded Memory BIST 287

5.17.4 Other DFT Features 287

5.18.1 Core DFT,Vectors,and Test Economics 289

5.18.2 Core Selection with Consideration to DFT Economics 289

5.18 Core Test Economics 289

5.19 Chip Design with a Core 292

5.19.1 Elements of a Core-Based Chip 292

5.19.2 Embedded Core Integration Concerns 292

5.19.3 Chip-Level DFT 293

5.20 Scan Testing the Isolated Core 296

5.21 Scan Testing the Non-Core Logic 298

5.21.1 Scan Testing the Non-Core Logic in Isolation 298

5.21.2 Chip-Level Testing and Tester Edge Sets 298

5.22 User Defined Logic Chip-Level DFT Concerns 300

5.23 Memory Testing with BIST 302

5.24 Chip-Level DFT Integration Requirements 304

5.24.1 Embedded Core-Based DFT Integration Architecture 304

5.24.2 Physical Concerns 305

5.25 Embedded Test Programs 307

5.26 Selecting or Receiving a Core 309

5.27 Embedded Core DFT Summary 311

5.28 Recommended Reading 311

About the CD 313

Glossary of Terms 317

Index 341

About the Author 348